Yick Bond Technologies Limited's Hong Kong CR Number is 1898471. Incorporation Date is 26-APR-2013. It's Winding up Mode is . Dissolution date is . Yick Bond Technologies Limited company is of Private company limited by shares Type.
Additional Remarks on the Yick Bond Technologies Limited company are Deregistration.
| CRN | 1898471 |
| Company Name | YICK BOND TECHNOLOGIES LIMITED |
| Chinese Name | 益邦科技有限公司 |
| Active Status | Live |
| Register of Charges | Unavailable |
| Type | Private company limited by shares See other companies with same Type - Private company limited by shares |
| Winding Up Mode | |
| Date of Incorporation | 26-APR-2013 See companies with same Incorporation Date - 26-APR-2013 |
| Date of Dissolution | |
| Remarks | Deregistration |
| Important Note | |
| Tags | yick technologies bond Find Similar Companies by these tags. |
| Effective Date | Previous Name |
|---|---|
| YICK BOND TECHNOLOGIES LIMITED | 26-APR-2013 |
Yick Bond Technologies Limited was incorporated on 26-APR-2013 in Hongkong.
Yick Bond Technologies Limited is classified as Private company limited by shares.
The status of Yick Bond Technologies Limited is Live.
The CR Number of Yick Bond Technologies Limited is 1898471.
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Last Updated on 15-07-2016.