Well Bond Development Limited Company Information Views 54

Current Status : Dissolved

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Well Bond Development Limited's Hong Kong CR Number is 215486. Incorporation Date is 06-MAY-1988. It's Winding up Mode is . Dissolution date is 30-SEP-2011. Well Bond Development Limited company is of Private company limited by shares Type.
Additional Remarks on the Well Bond Development Limited company are Dissolved by Deregistration.

CRN	215486
Company Name	WELL BOND DEVELOPMENT LIMITED
Chinese Name	和邦集團有限公司
Active Status	Dissolved
Register of Charges	Unavailable
Type	Private company limited by shares See other companies with same Type - Private company limited by shares
Winding Up Mode
Date of Incorporation	06-MAY-1988 See companies with same Incorporation Date - 06-MAY-1988
Date of Dissolution	30-SEP-2011
Remarks	Dissolved by Deregistration
Important Note
Tags	development   well   bond    Find Similar Companies by these tags.

Company Name History Information :

Effective Date	Previous Name
WELL BOND DEVELOPMENT LIMITED	06-MAY-1988
WELL BOND DEVELOPMENT LIMITED	15-JUL-1988
WELL BOND DEVELOPMENT LIMITED	17-FEB-1997
WELL BOND DEVELOPMENT LIMITED	30-JAN-1996

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Last Updated on 30-08-2016.

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