Wafer Tech Asia Limited Company Information Views 18

Current Status : Dissolved

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Wafer Tech Asia Limited's Hong Kong CR Number is 637371. Incorporation Date is 25-FEB-1998. It's Winding up Mode is . Dissolution date is 28-JAN-2005. Wafer Tech Asia Limited company is of Private company limited by shares Type.
Additional Remarks on the Wafer Tech Asia Limited company are Dissolved by Deregistration.

CRN	637371
Company Name	WAFER TECH ASIA LIMITED
Chinese Name	亞洲晶片科技有限公司
Active Status	Dissolved
Register of Charges	Unavailable
Type	Private company limited by shares See other companies with same Type - Private company limited by shares
Winding Up Mode
Date of Incorporation	25-FEB-1998 See companies with same Incorporation Date - 25-FEB-1998
Date of Dissolution	28-JAN-2005
Remarks	Dissolved by Deregistration
Important Note
Tags	tech   asia   wafer    Find Similar Companies by these tags.

Company Name History Information :

Effective Date	Previous Name
WAFER TECH ASIA LIMITED	16-MAR-1998
WAFER TECH ASIA LIMITED	25-FEB-1998

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Last Updated on 29-07-2016.

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