Top Bond Technology Limited Company Information

Current Status : Dissolved


Top Bond Technology Limited's Hong Kong CR Number is 934308. Incorporation Date is 17-NOV-2004. It's Winding up Mode is Members' Voluntary Winding Up. Dissolution date is 15-MAY-2012. Top Bond Technology Limited company is of Private company limited by shares Type.
Additional Remarks on the Top Bond Technology Limited company are Dissolved by Members' Voluntary Winding Up.

Company Data

CRN934308
Company NameTOP BOND TECHNOLOGY LIMITED
Chinese Name駿邦科技有限公司
Active StatusDissolved
Register of ChargesUnavailable
TypePrivate company limited by shares
See other companies with same Type - Private company limited by shares
Winding Up ModeMembers' Voluntary Winding Up
Date of Incorporation17-NOV-2004
See companies with same Incorporation Date - 17-NOV-2004
Date of Dissolution15-MAY-2012
RemarksDissolved by Members' Voluntary Winding Up
Important Note
Tagstechnology   bond   
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Company Name History Information :

Effective DatePrevious Name
TOP BOND TECHNOLOGY LIMITED17-NOV-2004

FAQs:

When was Top Bond Technology Limited incorporated?

Top Bond Technology Limited was incorporated on 17-NOV-2004 in Hongkong.

What is the type of Top Bond Technology Limited?

Top Bond Technology Limited is classified as Private company limited by shares.

What is the current status of Top Bond Technology Limited Company?

The status of Top Bond Technology Limited is Dissolved.

What is the CR Number of Top Bond Technology Limited?

The CR Number of Top Bond Technology Limited is 934308.

* We are trying our best to keep all the data correct and up-to-date. It should be noted that it is not the primary source of the information on the company Top Bond Technology Limited. The official registry should always be referred for latest information.

Last Updated on 03-07-2016.

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