Top Bond Technology Limited Company Information Views 32

Current Status : Dissolved

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Top Bond Technology Limited's Hong Kong CR Number is 934308. Incorporation Date is 17-NOV-2004. It's Winding up Mode is Members' Voluntary Winding Up. Dissolution date is 15-MAY-2012. Top Bond Technology Limited company is of Private company limited by shares Type.
Additional Remarks on the Top Bond Technology Limited company are Dissolved by Members' Voluntary Winding Up.

CRN	934308
Company Name	TOP BOND TECHNOLOGY LIMITED
Chinese Name	駿邦科技有限公司
Active Status	Dissolved
Register of Charges	Unavailable
Type	Private company limited by shares See other companies with same Type - Private company limited by shares
Winding Up Mode	Members' Voluntary Winding Up
Date of Incorporation	17-NOV-2004 See companies with same Incorporation Date - 17-NOV-2004
Date of Dissolution	15-MAY-2012
Remarks	Dissolved by Members' Voluntary Winding Up
Important Note
Tags	technology   bond    Find Similar Companies by these tags.

Company Name History Information :

Effective Date	Previous Name
TOP BOND TECHNOLOGY LIMITED	17-NOV-2004

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Last Updated on 03-07-2016.

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