Semiconductor Mold & Die Limited Company Information Views 28

Current Status : Dissolved

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Semiconductor Mold & Die Limited's Hong Kong CR Number is 255807. Incorporation Date is 21-JUN-1989. It's Winding up Mode is . Dissolution date is 30-JUL-2004. Semiconductor Mold & Die Limited company is of Private company limited by shares Type.
Additional Remarks on the Semiconductor Mold & Die Limited company are Dissolved by Deregistration.

CRN	255807
Company Name	SEMICONDUCTOR MOLD & DIE LIMITED
Chinese Name	半導體模具製作有限公司
Active Status	Dissolved
Register of Charges	Unavailable
Type	Private company limited by shares See other companies with same Type - Private company limited by shares
Winding Up Mode
Date of Incorporation	21-JUN-1989 See companies with same Incorporation Date - 21-JUN-1989
Date of Dissolution	30-JUL-2004
Remarks	Dissolved by Deregistration
Important Note
Tags	semiconductor   mold    Find Similar Companies by these tags.

Company Name History Information :

Effective Date	Previous Name
SEMICONDUCTOR MOLD & DIE LIMITED	02-MAY-1996
SEMI-CONDUCTOR MOLD & DIES LIMITED	17-NOV-1992
SEMICONDUCTOR MOLD & DIES LIMITED	18-FEB-1993
KUK JE MOLD & DIES (INTERNATIONAL) LIMITED	21-JUN-1989

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Last Updated on 25-08-2016.

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