J. Bond Technology Company Limited Company Information Views 26

Current Status : Live

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J. Bond Technology Company Limited's Hong Kong CR Number is 972750. Incorporation Date is 25-MAY-2005. It's Winding up Mode is . Dissolution date is . J. Bond Technology Company Limited company is of Private company limited by shares Type.
Additional Remarks on the J. Bond Technology Company Limited company are .

CRN	972750
Company Name	J. Bond Technology Company Limited
Chinese Name	佳邦科技有限公司
Active Status	Live
Register of Charges	Unavailable
Type	Private company limited by shares See other companies with same Type - Private company limited by shares
Winding Up Mode
Date of Incorporation	25-MAY-2005 See companies with same Incorporation Date - 25-MAY-2005
Date of Dissolution
Remarks
Important Note
Tags	technology   bond    Find Similar Companies by these tags.

Company Name History Information :

Effective Date	Previous Name
J. Bond Technology Company Limited	25-MAY-2005

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Last Updated on 30-06-2016.

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