Gold Bond Engineering Materials Limited Company Information Views 12

Current Status : Live

---

Gold Bond Engineering Materials Limited's Hong Kong CR Number is 1063221. Incorporation Date is 29-JUL-2006. It's Winding up Mode is . Dissolution date is . Gold Bond Engineering Materials Limited company is of Private company limited by shares Type.
Additional Remarks on the Gold Bond Engineering Materials Limited company are .

CRN	1063221
Company Name	GOLD BOND ENGINEERING MATERIALS LIMITED
Chinese Name	金邦工程物料有限公司
Active Status	Live
Register of Charges	Unavailable
Type	Private company limited by shares See other companies with same Type - Private company limited by shares
Winding Up Mode
Date of Incorporation	29-JUL-2006 See companies with same Incorporation Date - 29-JUL-2006
Date of Dissolution
Remarks
Important Note
Tags	engineering   materials   gold   bond    Find Similar Companies by these tags.

Company Name History Information :

Effective Date	Previous Name
GOLD BOND ENGINEERING MATERIALS LIMITED	29-JUL-2006

* We are trying our best to keep all the data correct and up-to-date. It should be noted that it is not the primary source of the information on the company Gold Bond Engineering Materials Limited. The official registry should always be referred for latest information.

Last Updated on 24-06-2016.

Check other companies added on 24-06-2016

Check out Companies Incorporated on 29-JUL-2006: