China Bond Technology Development Limited Company Information

Current Status : Dissolved


China Bond Technology Development Limited's Hong Kong CR Number is 1035265. Incorporation Date is 31-MAR-2006. It's Winding up Mode is . Dissolution date is 27-APR-2012. China Bond Technology Development Limited company is of Private company limited by shares Type.
Additional Remarks on the China Bond Technology Development Limited company are Dissolved by Striking Off.

Company Data

CRN1035265
Company NameCHINA BOND TECHNOLOGY DEVELOPMENT LIMITED
Chinese Name中強科技發展有限公司
Active StatusDissolved
Register of ChargesUnavailable
TypePrivate company limited by shares
See other companies with same Type - Private company limited by shares
Winding Up Mode
Date of Incorporation31-MAR-2006
See companies with same Incorporation Date - 31-MAR-2006
Date of Dissolution27-APR-2012
RemarksDissolved by Striking Off
Important Note
Tagsdevelopment   technology   china   bond   
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Company Name History Information :

Effective DatePrevious Name
CHINA BOND TECHNOLOGY DEVELOPMENT LIMITED31-MAR-2006

FAQs:

When was China Bond Technology Development Limited incorporated?

China Bond Technology Development Limited was incorporated on 31-MAR-2006 in Hongkong.

What is the type of China Bond Technology Development Limited?

China Bond Technology Development Limited is classified as Private company limited by shares.

What is the current status of China Bond Technology Development Limited Company?

The status of China Bond Technology Development Limited is Dissolved.

What is the CR Number of China Bond Technology Development Limited?

The CR Number of China Bond Technology Development Limited is 1035265.

* We are trying our best to keep all the data correct and up-to-date. It should be noted that it is not the primary source of the information on the company China Bond Technology Development Limited. The official registry should always be referred for latest information.

Last Updated on 28-06-2016.

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