Bondsemi Technology Limited's Hong Kong CR Number is 1460759. Incorporation Date is 26-MAY-2010. It's Winding up Mode is . Dissolution date is 17-JUL-2015. Bondsemi Technology Limited company is of Private company limited by shares Type.
Additional Remarks on the Bondsemi Technology Limited company are Dissolved by Deregistration.
| CRN | 1460759 |
| Company Name | BONDSEMI TECHNOLOGY LIMITED |
| Chinese Name | 振邦微科技有限公司 |
| Active Status | Dissolved |
| Register of Charges | Unavailable |
| Type | Private company limited by shares See other companies with same Type - Private company limited by shares |
| Winding Up Mode | |
| Date of Incorporation | 26-MAY-2010 See companies with same Incorporation Date - 26-MAY-2010 |
| Date of Dissolution | 17-JUL-2015 |
| Remarks | Dissolved by Deregistration |
| Important Note | |
| Tags | technology bondsemi Find Similar Companies by these tags. |
| Effective Date | Previous Name |
|---|---|
| BONDSEMI TECHNOLOGY LIMITED | 26-MAY-2010 |
Bondsemi Technology Limited was incorporated on 26-MAY-2010 in Hongkong.
Bondsemi Technology Limited is classified as Private company limited by shares.
The status of Bondsemi Technology Limited is Dissolved.
The CR Number of Bondsemi Technology Limited is 1460759.
* We are trying our best to keep all the data correct and up-to-date. It should be noted that it is not the primary source of the information on the company Bondsemi Technology Limited. The official registry should always be referred for latest information.
Last Updated on 06-09-2016.