Bonds Technology Limited Company Information

Current Status : Dissolved


Bonds Technology Limited's Hong Kong CR Number is 863313. Incorporation Date is 26-SEP-2003. It's Winding up Mode is . Dissolution date is 06-NOV-2015. Bonds Technology Limited company is of Private company limited by shares Type.
Additional Remarks on the Bonds Technology Limited company are Dissolved by Deregistration.

Company Data

CRN863313
Company NameBONDS TECHNOLOGY LIMITED
Chinese Name邦時科技有限公司
Active StatusDissolved
Register of ChargesUnavailable
TypePrivate company limited by shares
See other companies with same Type - Private company limited by shares
Winding Up Mode
Date of Incorporation26-SEP-2003
See companies with same Incorporation Date - 26-SEP-2003
Date of Dissolution06-NOV-2015
RemarksDissolved by Deregistration
Important Note
Tagstechnology   bonds   
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Company Name History Information :

Effective DatePrevious Name
BONDS TECHNOLOGY LIMITED26-SEP-2003

FAQs:

When was Bonds Technology Limited incorporated?

Bonds Technology Limited was incorporated on 26-SEP-2003 in Hongkong.

What is the type of Bonds Technology Limited?

Bonds Technology Limited is classified as Private company limited by shares.

What is the current status of Bonds Technology Limited Company?

The status of Bonds Technology Limited is Dissolved.

What is the CR Number of Bonds Technology Limited?

The CR Number of Bonds Technology Limited is 863313.

* We are trying our best to keep all the data correct and up-to-date. It should be noted that it is not the primary source of the information on the company Bonds Technology Limited. The official registry should always be referred for latest information.

Last Updated on 09-07-2016.

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