Bonds Technology Limited Company Information Views 24

Current Status : Dissolved

---

Bonds Technology Limited's Hong Kong CR Number is 863313. Incorporation Date is 26-SEP-2003. It's Winding up Mode is . Dissolution date is 06-NOV-2015. Bonds Technology Limited company is of Private company limited by shares Type.
Additional Remarks on the Bonds Technology Limited company are Dissolved by Deregistration.

CRN	863313
Company Name	BONDS TECHNOLOGY LIMITED
Chinese Name	邦時科技有限公司
Active Status	Dissolved
Register of Charges	Unavailable
Type	Private company limited by shares See other companies with same Type - Private company limited by shares
Winding Up Mode
Date of Incorporation	26-SEP-2003 See companies with same Incorporation Date - 26-SEP-2003
Date of Dissolution	06-NOV-2015
Remarks	Dissolved by Deregistration
Important Note
Tags	technology   bonds    Find Similar Companies by these tags.

Company Name History Information :

Effective Date	Previous Name
BONDS TECHNOLOGY LIMITED	26-SEP-2003

* We are trying our best to keep all the data correct and up-to-date. It should be noted that it is not the primary source of the information on the company Bonds Technology Limited. The official registry should always be referred for latest information.

Last Updated on 09-07-2016.

Check other companies added on 09-07-2016

Check out Companies Incorporated on 26-SEP-2003: