Bond Well Hong Kong Technology Limited Company Information Views 22

Current Status : Live

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Bond Well Hong Kong Technology Limited's Hong Kong CR Number is 636670. Incorporation Date is 18-FEB-1998. It's Winding up Mode is . Dissolution date is . Bond Well Hong Kong Technology Limited company is of Private company limited by shares Type.
Additional Remarks on the Bond Well Hong Kong Technology Limited company are .

CRN	636670
Company Name	BOND WELL HONG KONG TECHNOLOGY LIMITED
Chinese Name	寶華香港科技有限公司
Active Status	Live
Register of Charges	Unavailable
Type	Private company limited by shares See other companies with same Type - Private company limited by shares
Winding Up Mode
Date of Incorporation	18-FEB-1998 See companies with same Incorporation Date - 18-FEB-1998
Date of Dissolution
Remarks
Important Note
Tags	technology   hong   kong   well   bond    Find Similar Companies by these tags.

Company Name History Information :

Effective Date	Previous Name
BOND WELL HONG KONG TECHNOLOGY LIMITED	18-FEB-1998

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Last Updated on 29-07-2016.

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