Bond Tech (Hong Kong) Limited Company Information Views 30

Current Status : Dissolved

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Bond Tech (Hong Kong) Limited's Hong Kong CR Number is 805605. Incorporation Date is 10-JUL-2002. It's Winding up Mode is . Dissolution date is 10-JAN-2014. Bond Tech (Hong Kong) Limited company is of Private company limited by shares Type.
Additional Remarks on the Bond Tech (Hong Kong) Limited company are Dissolved by Deregistration.

CRN	805605
Company Name	BOND TECH (HONG KONG) LIMITED
Chinese Name	邦得(香港)有限公司
Active Status	Dissolved
Register of Charges	Unavailable
Type	Private company limited by shares See other companies with same Type - Private company limited by shares
Winding Up Mode
Date of Incorporation	10-JUL-2002 See companies with same Incorporation Date - 10-JUL-2002
Date of Dissolution	10-JAN-2014
Remarks	Dissolved by Deregistration
Important Note
Tags	hong   kong   tech   bond    Find Similar Companies by these tags.

Company Name History Information :

Effective Date	Previous Name
BOND TECH (HONG KONG) LIMITED	10-JUL-2002

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Last Updated on 13-07-2016.

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