Bond Tech Development Limited Company Information

Current Status : Dissolved


Bond Tech Development Limited's Hong Kong CR Number is 334257. Incorporation Date is 19-NOV-1991. It's Winding up Mode is . Dissolution date is 01-MAR-2002. Bond Tech Development Limited company is of Private company limited by shares Type.
Additional Remarks on the Bond Tech Development Limited company are Dissolved by Deregistration.

Company Data

CRN334257
Company NameBOND TECH DEVELOPMENT LIMITED
Chinese Name寶大發展有限公司
Active StatusDissolved
Register of ChargesUnavailable
TypePrivate company limited by shares
See other companies with same Type - Private company limited by shares
Winding Up Mode
Date of Incorporation19-NOV-1991
See companies with same Incorporation Date - 19-NOV-1991
Date of Dissolution01-MAR-2002
RemarksDissolved by Deregistration
Important Note
Tagsdevelopment   tech   bond   
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Company Name History Information :

Effective DatePrevious Name
BOND TECH DEVELOPMENT LIMITED19-NOV-1991
BOND TECH DEVELOPMENT LIMITED28-JAN-1992

FAQs:

When was Bond Tech Development Limited incorporated?

Bond Tech Development Limited was incorporated on 19-NOV-1991 in Hongkong.

What is the type of Bond Tech Development Limited?

Bond Tech Development Limited is classified as Private company limited by shares.

What is the current status of Bond Tech Development Limited Company?

The status of Bond Tech Development Limited is Dissolved.

What is the CR Number of Bond Tech Development Limited?

The CR Number of Bond Tech Development Limited is 334257.

* We are trying our best to keep all the data correct and up-to-date. It should be noted that it is not the primary source of the information on the company Bond Tech Development Limited. The official registry should always be referred for latest information.

Last Updated on 06-09-2016.

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