Bond Plan Development Limited Company Information Views 59

Current Status : Dissolved

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Bond Plan Development Limited's Hong Kong CR Number is 209674. Incorporation Date is 05-FEB-1988. It's Winding up Mode is . Dissolution date is 21-MAR-1997. Bond Plan Development Limited company is of Private company limited by shares Type.
Additional Remarks on the Bond Plan Development Limited company are Dissolved by Striking Off.

CRN	209674
Company Name	BOND PLAN DEVELOPMENT LIMITED
Chinese Name	奔建發展有限公司
Active Status	Dissolved
Register of Charges	Unavailable
Type	Private company limited by shares See other companies with same Type - Private company limited by shares
Winding Up Mode
Date of Incorporation	05-FEB-1988 See companies with same Incorporation Date - 05-FEB-1988
Date of Dissolution	21-MAR-1997
Remarks	Dissolved by Striking Off
Important Note
Tags	development   plan   bond    Find Similar Companies by these tags.

Company Name History Information :

Effective Date	Previous Name
BOND PLAN DEVELOPMENT LIMITED	05-FEB-1988

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Last Updated on 30-08-2016.

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