Bond Nano Technology (Hong Kong) Limited Company Information Views 29

Current Status : Dissolved

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Bond Nano Technology (Hong Kong) Limited's Hong Kong CR Number is 1221815. Incorporation Date is 01-APR-2008. It's Winding up Mode is . Dissolution date is 27-APR-2012. Bond Nano Technology (Hong Kong) Limited company is of Private company limited by shares Type.
Additional Remarks on the Bond Nano Technology (Hong Kong) Limited company are Dissolved by Striking Off.

CRN	1221815
Company Name	BOND NANO TECHNOLOGY (HONG KONG) LIMITED
Chinese Name	邦德納米科技(香港)有限公司
Active Status	Dissolved
Register of Charges	Unavailable
Type	Private company limited by shares See other companies with same Type - Private company limited by shares
Winding Up Mode
Date of Incorporation	01-APR-2008 See companies with same Incorporation Date - 01-APR-2008
Date of Dissolution	27-APR-2012
Remarks	Dissolved by Striking Off
Important Note
Tags	hong   kong   technology   nano   bond    Find Similar Companies by these tags.

Company Name History Information :

Effective Date	Previous Name
BOND NANO TECHNOLOGY (HONG KONG) LIMITED	01-APR-2008

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Last Updated on 10-09-2016.

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