Bond Care Development Limited Company Information Views 27

Current Status : Dissolved

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Bond Care Development Limited's Hong Kong CR Number is 228571. Incorporation Date is 30-SEP-1988. It's Winding up Mode is . Dissolution date is 25-APR-1997. Bond Care Development Limited company is of Private company limited by shares Type.
Additional Remarks on the Bond Care Development Limited company are Dissolved by Striking Off.

CRN	228571
Company Name	BOND CARE DEVELOPMENT LIMITED
Chinese Name	博勤發展有限公司
Active Status	Dissolved
Register of Charges	Unavailable
Type	Private company limited by shares See other companies with same Type - Private company limited by shares
Winding Up Mode
Date of Incorporation	30-SEP-1988 See companies with same Incorporation Date - 30-SEP-1988
Date of Dissolution	25-APR-1997
Remarks	Dissolved by Striking Off
Important Note
Tags	development   care   bond    Find Similar Companies by these tags.

Company Name History Information :

Effective Date	Previous Name
BOND CARE DEVELOPMENT LIMITED	30-SEP-1988

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Last Updated on 28-08-2016.

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