Bond Bond Limited Company Information Views 29

Current Status : Dissolved

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Bond Bond Limited's Hong Kong CR Number is 738874. Incorporation Date is 22-NOV-2000. It's Winding up Mode is . Dissolution date is 01-MAR-2002. Bond Bond Limited company is of Private company limited by shares Type.
Additional Remarks on the Bond Bond Limited company are Dissolved by Deregistration.

CRN	738874
Company Name	BOND BOND LIMITED
Chinese Name	None
Active Status	Dissolved
Register of Charges	Unavailable
Type	Private company limited by shares See other companies with same Type - Private company limited by shares
Winding Up Mode
Date of Incorporation	22-NOV-2000 See companies with same Incorporation Date - 22-NOV-2000
Date of Dissolution	01-MAR-2002
Remarks	Dissolved by Deregistration
Important Note
Tags	bond    Find Similar Companies by these tags.

Company Name History Information :

Effective Date	Previous Name
BOND BOND LIMITED	10-AUG-2001
HI SUN GROUP LIMITED	11-JUN-2001
HIGH STANDARD RESOURCES LIMITED	22-NOV-2000
HI SUN HOLDINGS LIMITED	25-APR-2001

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Last Updated on 19-07-2016.

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