Asian Bond Market Forum Limited Company Information Views 30

Current Status : Dissolved

---

Asian Bond Market Forum Limited's Hong Kong CR Number is 931759. Incorporation Date is 03-NOV-2004. It's Winding up Mode is Members' Voluntary Winding Up. Dissolution date is 28-FEB-2014. Asian Bond Market Forum Limited company is of Company limited by guarantee Type.
Additional Remarks on the Asian Bond Market Forum Limited company are Dissolved by Members' Voluntary Winding Up.

CRN	931759
Company Name	ASIAN BOND MARKET FORUM LIMITED
Chinese Name	None
Active Status	Dissolved
Register of Charges	Unavailable
Type	Company limited by guarantee See other companies with same Type - Company limited by guarantee
Winding Up Mode	Members' Voluntary Winding Up
Date of Incorporation	03-NOV-2004 See companies with same Incorporation Date - 03-NOV-2004
Date of Dissolution	28-FEB-2014
Remarks	Dissolved by Members' Voluntary Winding Up
Important Note
Tags	forum   asian   market   bond    Find Similar Companies by these tags.

Company Name History Information :

Effective Date	Previous Name
ASIAN BOND MARKET FORUM LIMITED	03-NOV-2004

* We are trying our best to keep all the data correct and up-to-date. It should be noted that it is not the primary source of the information on the company Asian Bond Market Forum Limited. The official registry should always be referred for latest information.

Last Updated on 03-07-2016.

Check other companies added on 03-07-2016

Check out Companies Incorporated on 03-NOV-2004: