A Bond Technology International Co., Limited Company Information Views 22

Current Status : Dissolved

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A Bond Technology International Co., Limited's Hong Kong CR Number is 1327676. Incorporation Date is 27-MAR-2009. It's Winding up Mode is . Dissolution date is 01-AUG-2014. A Bond Technology International Co., Limited company is of Private company limited by shares Type.
Additional Remarks on the A Bond Technology International Co., Limited company are Dissolved by Striking Off.

CRN	1327676
Company Name	A Bond Technology International Co., Limited
Chinese Name	亞邦技術國際有限公司
Active Status	Dissolved
Register of Charges	Unavailable
Type	Private company limited by shares See other companies with same Type - Private company limited by shares
Winding Up Mode
Date of Incorporation	27-MAR-2009 See companies with same Incorporation Date - 27-MAR-2009
Date of Dissolution	01-AUG-2014
Remarks	Dissolved by Striking Off
Important Note
Tags	international   technology   co   bond    Find Similar Companies by these tags.

Company Name History Information :

Effective Date	Previous Name
A Bond Technology International Co., Limited	27-MAR-2009

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Last Updated on 30-08-2016.

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