Yick Bond Technologies Limited Company Information

Current Status : Live


Yick Bond Technologies Limited's Hong Kong CR Number is 1898471. Incorporation Date is 26-APR-2013. It's Winding up Mode is . Dissolution date is . Yick Bond Technologies Limited company is of Private company limited by shares Type.
Additional Remarks on the Yick Bond Technologies Limited company are Deregistration.

Company Data

CRN1898471
Company NameYICK BOND TECHNOLOGIES LIMITED
Chinese Name益邦科技有限公司
Active StatusLive
Register of ChargesUnavailable
TypePrivate company limited by shares
See other companies with same Type - Private company limited by shares
Winding Up Mode
Date of Incorporation26-APR-2013
See companies with same Incorporation Date - 26-APR-2013
Date of Dissolution
RemarksDeregistration
Important Note
Tagsyick   technologies   bond   
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Company Name History Information :

Effective DatePrevious Name
YICK BOND TECHNOLOGIES LIMITED26-APR-2013

FAQs:

When was Yick Bond Technologies Limited incorporated?

Yick Bond Technologies Limited was incorporated on 26-APR-2013 in Hongkong.

What is the type of Yick Bond Technologies Limited?

Yick Bond Technologies Limited is classified as Private company limited by shares.

What is the current status of Yick Bond Technologies Limited Company?

The status of Yick Bond Technologies Limited is Live.

What is the CR Number of Yick Bond Technologies Limited?

The CR Number of Yick Bond Technologies Limited is 1898471.

* We are trying our best to keep all the data correct and up-to-date. It should be noted that it is not the primary source of the information on the company Yick Bond Technologies Limited. The official registry should always be referred for latest information.

Last Updated on 15-07-2016.

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