Bondsemi Technology Limited Company Information

Current Status : Dissolved


Bondsemi Technology Limited's Hong Kong CR Number is 1460759. Incorporation Date is 26-MAY-2010. It's Winding up Mode is . Dissolution date is 17-JUL-2015. Bondsemi Technology Limited company is of Private company limited by shares Type.
Additional Remarks on the Bondsemi Technology Limited company are Dissolved by Deregistration.

Company Data

CRN1460759
Company NameBONDSEMI TECHNOLOGY LIMITED
Chinese Name振邦微科技有限公司
Active StatusDissolved
Register of ChargesUnavailable
TypePrivate company limited by shares
See other companies with same Type - Private company limited by shares
Winding Up Mode
Date of Incorporation26-MAY-2010
See companies with same Incorporation Date - 26-MAY-2010
Date of Dissolution17-JUL-2015
RemarksDissolved by Deregistration
Important Note
Tagstechnology   bondsemi   
Find Similar Companies by these tags.

Company Name History Information :

Effective DatePrevious Name
BONDSEMI TECHNOLOGY LIMITED26-MAY-2010

FAQs:

When was Bondsemi Technology Limited incorporated?

Bondsemi Technology Limited was incorporated on 26-MAY-2010 in Hongkong.

What is the type of Bondsemi Technology Limited?

Bondsemi Technology Limited is classified as Private company limited by shares.

What is the current status of Bondsemi Technology Limited Company?

The status of Bondsemi Technology Limited is Dissolved.

What is the CR Number of Bondsemi Technology Limited?

The CR Number of Bondsemi Technology Limited is 1460759.

* We are trying our best to keep all the data correct and up-to-date. It should be noted that it is not the primary source of the information on the company Bondsemi Technology Limited. The official registry should always be referred for latest information.

Last Updated on 06-09-2016.

Check other companies added on 06-09-2016

Check out Companies Incorporated on 26-MAY-2010: